| 摘要 |
PROBLEM TO BE SOLVED: To obtain a socket structure allowing repeated connections of a packaged device or integrated circuit to a DUT board, by urging at least one conductive lead of the electronic circuit to be tested and a single electric signal or a pair of electric signals, and mutually connecting an electronic circuit tester measuring the response of the electronic circuit. SOLUTION: When at least one lead 104A of a packaged device or integrated circuit 102 butts in touch with a first end part 124A of a contact 124, a second surface 124D of the contact slides in a direction towards a second end part 124B, whereby a second elastic member 120 is compressed. The first end part 124A of the contact is brought in slight tough with at least one lead 104A of the device or integrated circuit 102. Thereafter, the second surface 124D of the contact comes slightly in touch with a surface 122C of a projecting part 122G of a contact frame 122. Accordingly, an electric signal route between at least one lead and a DUT board 106 via the contact and the contact frame becomes minimum. |
