| 摘要 |
PURPOSE: To provide a chip type current protecting element excellent in insulation property after fused by having an insulating substrate, a pair of electrodes and a current protecting element wiring portion provided with a cavity in place to be fused. CONSTITUTION: An extremely thin copper foil 110 and a copper foil 130 are provided on both faces of an organic resin base material 120 to form the pattern of a current protecting element wiring portion 150 with 3-8μm wirings on the extremely thin copper foil 110. The pattern is formed for a plural of current protecting element wiring portion 150 to be longitudinally in series across an electrode portion 140 and laterally in one line of continuously parallel arrangement. Other copper foils 130 are provided on both faces, an organic resin base material 121 with a cavity forming hole 160 is prepared and the current protecting element wiring portion composition, the insulating material with the hole and an organic resin insulating base material 123 with a copper foil 130 on one face are adhered and jointed together. An end face connecting hole 170 is made in such a laminate, plating 180 is applied thereto and then an electrode portion 190 is formed. In this way, a chip type current protecting element excellent in fusion property is provided.
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