| 摘要 |
PURPOSE: To remove free-chip type large semiconductors carrying bumps on their entire surfaces or the packages of the semiconductors by cutting off the bumps by fusion by conducting a platy exothermic resistor, the diameter or thickness of which is made smaller than the height of the bumps. CONSTITUTION: Semiconductor chips or semiconductor packages 1 are connected to a substrate 2 through connecting bumps 3 of solder balls, etc. An exothermic resistor 4, the diameter or thickness of which is made smaller than the height of the bumps 3, is fixed to a holder electrode 5 with exothermic resistor fixing screws 6. A holder 7 holds the electrode 5 and holds and insulates the conductor connecting the electrode 5 to a power source. The holder 7 is attached to an arm 51 connected to an XYZ stage 52, moved to the position of a semiconductor 1, etc., to be mounted by means of the stage 52 and, at the same time, adjusts the height of the resistor 4 so that the resistor 4 can get in between the semiconductor 1, etc., and the substrate 2. The resistor 4 is moved to cut off the connecting bumps 3 by fusion. |
