| 摘要 |
PURPOSE: To provide a wire bonding device, which wire bonds a semiconductor chip to a lead frame in the production process of a semiconductor device and can detect reliably the positional deviation of lead terminals in a short time, and a method of manufacturing the device. CONSTITUTION: A wire bonding device is provided with a plurality of probes 81 with the points, which are respectively positioned at the reference positions of lead terminals 12 of a lead frame 1, and the wire bonding device has a probe card 8 mounted in such a way that the card 8 is moved in the direction XY along the lead frame 1 and is movable in the vertical directions. The card 8, which is moved in the direction XY and is positioned on the frame 1, is made to descend, whereby it is made possible that the respective probes 81 are in contact with the lead terminals arranged at the prescribed positions. |
