| 摘要 |
PURPOSE: To facilitate the alignment of a pin with a solder while preventing the concentration of thermal stress on a specific interface by a method wherein the pin is directly fixed to an electrode formed on the underside of a semiconductor chip while the other end of the pin is connected to a main surface of an insulating substrate using a ringed solder formed by plating method. CONSTITUTION: Electrodes 7 and 7' are formed respectively on a semiconductor chip 1 and an insulating substrate 2. The electrode 7 is connected to a ball formed on one end of a pin 5 while the other end of the pin 5 not forming the ball is connected to the electrode 7' on the insulating substrate 2 through a solder layer 6 so as to be electrically connected to the electrode 7' on the insulating substrate 2. Through these procedures, the shearing strength due to the difference in the thermal expansion coefficients between the semiconductor chip 1 and the insulating substrate 2 is given out by the pin 5 to prevent the concentration of the thermal stress on a specific interface so that any cracking may be hardly caused on any junction parts while facilitating the alignment of the pins with the solder layer 6. |
