| 摘要 |
PURPOSE: To obtain a space saving shield structure of hybrid integrated circuit device in which a shield member can be bonded to a main board without relying on the soldering or screws. CONSTITUTION: A resin frame 2 is arranged at the circumferential fringe on one surface of a wiring board la and an IC chip 3 is mounted in the center. The resin frame 2 is applied with a shielding metal housing 7 having an opening to be fitted to the outer circumference thereof. The metal housing 7 has bottom face 8 recessed toward the board side and a plurality of through ports 10a, 10b are made through the bottom face 8 of the recess 9. Furthermore, the housing has the fringe extended partially in terminal shape and bent downward along the side face of the board. The inner surface is bent down at a position where the inner surface is flush with the lower surface of the board 1a thus forming a shield electrode 11. Precoat resin 12 injected into the resin frame 2 applied with the metal housing 7 and into the recess 9 thereof is integrated through the through ports and bonded thus securing the metal housing 7. |
