发明名称 |
CHIP TYPE CURRENT PROTECTING ELEMENT AND ITS MANUFACTURE |
摘要 |
PURPOSE: To manufacture a chip type current protecting element with good reliability and high insulating resistance after fused by having an insulating substrate, a pair of electrodes and a current protecting element wiring portion provided with a portion not adhered to the insulating substrate. CONSTITUTION: An organic resin insulating base material 2 is manufactured by pasting an extremely thin copper foil 1 on one face and a copper foil 3 on the other face to form the pattern of the current protecting element wiring portion of wiring thickness 3-8μm. The pattern is formed for a plural of current protecting element wiring portions 5 to be longitudinally in series across the electrode portion 4 and laterally in one line of continuously parallel arrangement. The current protecting element wiring portion formed and the organic resin insulating base material 21 with the copper foil 3 on one face are layered and adhered together via adhesive with a metal plate 6. One metal plate 6 with a hole is then used to make a non-adhered portion 7. An end face adhering hole 8 is made in such a laminated plate, plating 9 is applied thereto and then an electrode portion 10 is formed with etching.
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申请公布号 |
JPH08236003(A) |
申请公布日期 |
1996.09.13 |
申请号 |
JP19950312421 |
申请日期 |
1995.11.30 |
申请人 |
HITACHI CHEM CO LTD |
发明人 |
TSUYAMA KOICHI;NISHIMURA KOJI;IWASAKI YORIO;TANIGUCHI MINORU;TETSUPOUZUKA MITSUO;SHIMIZU WATARU;KOBORI HISACHIKA;TAKADA KOSUKE |
分类号 |
H01H69/02;H01H85/00;H01H85/02;H01H85/045;H01H85/046;H01H85/06;H01H85/143;H01H85/17;(IPC1-7):H01H85/00 |
主分类号 |
H01H69/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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