| 摘要 |
PURPOSE: To provide an IC chip, wherein a fixing agent can be prevented from squeezing out from the rear of the IC chip, by a method wherein an insulative sealing part for sealing the fixing agent, which secures the chip to a base body for mounting the IC chip, is provided. CONSTITUTION: An insulative sealing part 1 for sealing an eutectic solder 4, which secures an IC chip 2 to a lead frame 3, is provided on the rear of the IC chip 2. Thereby, when the chip 2 is secured to the frame 3, that is, when the chip 2 is die-bonded to the frame 3, the solder 4 is prevented from squeezing out from the secured rear of the chip 2 and creeping on the surface, on which various electrodes 5 are formed, of the chip 2. |
