SURFACE MOUNTING TYPE SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an inexpensive semiconductor package of a surface- mounting type in satisfactory contact with a substrate. SOLUTION: A semiconductor package of a surface mounting type is provided with a semiconductor buried in a plastic material body 10. An electric control connecting part to the semiconductor is provided with first and second vertical lead terminals 12 and 14, which are mutually deviated to facilitate the combining to a device in parallel. Power output is given by metallic pads 16 and 18, which are partially notched to make stage parts to be used when a lead frame of a single thickness manufactures the device. On the lower face of a body 10, channels 22 and 24 increasing an electrical creepage distance and improving the washing property of a residual material after the device is fitted to the substrate are formed.