Verfahren zum stromlosen Metallisieren von elektrisch nicht leitenden Substraten

摘要

In a currentless metallisation process for non electroconductive substrates, a metallisation backing layer is applied on the substrate before its metallisation. For that purpose, a positive paint containing organic metallic compounds is applied on the substrate, the positive paint is irradiated with UV light and the metallisation layer is deposited on the irradiated positive paint.