HEAT SINK FOR INTEGRATED CIRCUIT PACKAGES

摘要

A heat sink (52) for use in a molded integrated circuit package (38) includes a main body (54) formed of a thermally conductive material. The main body (54) has (i) an upwardly facing horizontally extending top surface (56) adapted to support either directly or indirectly an integrated circuit die (40), (ii) a downwardly facing horizontally extending bottom surface (58), (iii) an outer circumferential edge (60), and (iv) a slot (62) or recess (84) formed into the main body (54) of said heat sink (52). The slot (62) or recess (84) is adapted to receive some of an encapsulating material (50) during the molding of the integrated circuit package (38) so as to form a mechanical connection between the heat sink (52) and the package (38). And, the bottom surface (58) of the heat sink (52) is exposed on an external surface of the integrated circuit package (38) after the molding of the integrated circuit package (38) is complete.