| 摘要 |
An inner and outer diameter, chamfer working apparatus for substrates provides chamfer on an outer diameter end surface and an inner diameter end surface of a substrate by means of grinding work, and comprises an inner and outer diameter chamfer working machine (11) which is provided with grindstone and forms chamfer on the inner diameter end surface and the outer diameter end surface of the substrate by means of the grindstone, a measuring device (12) for successively measuring a chamfer length of a substrate machined by the inner and outer diameter chamfer working machine, a measuring processing device (13) for calculating correction for feed of the grindstone on the basis of a measuring result from the measuring device, and a control device (14) for controlling actuation of the inner and outer diameter chamfer working machine and modifying feed of the grindstone on the basis of an amount of correction from the measuring processing device.
|
