Bonding tool for electronic device

摘要

An ultrasonic bonding tool (102) for use in tape automated bonding and wedge bonding of gold and gold plated leads, or wires to contact pads of electronic devices is fabricated of hard material such as Aluminum Oxide ceramic without electrically conductive metallic binders and has a microscopically rough contact surface (106). The Aluminum Oxide ceramic bonding tool (102) is sufficiently hard that it does not readily deform under normal ultrasonic bonding conditions, and is not readily abraded by the gold leads. The roughness pattern may be parallel lines (Fig. 2B, not shown) or circular (Figs. 3B, 3C, not shown).