| 摘要 |
PURPOSE: To provide a polishing machine for a wafer which can improve uniformity of polishing by adjusting a contact pressure of a retainer ring to the optimum value. CONSTITUTION: A wafer holding head 32 of this machine includes a head body 34, a carrier 46 disposed in the head body 34, a retainer ring 50 disposed on the outer peripheral surface of the carrier 46, a diaphragm 44 pushing the carrier 46, a ring-shaped tube 54 made of elastic material inserted between the head body 34 and the retainer ring 50, and a second pressure adjusting mechanism 60 for adjusting the fluid pressure filled in the tube 54. |
