发明名称 METHOD OF BONDING BOARD SAWTOOTH TO CARTON
摘要 <p>PURPOSE: To form a board sawtooth and, at the same time, quickly and reliably perform ultrasonic bonding of the same to a carton at a predetermined position. CONSTITUTION: A board sawtooth 2 and a carton base material 4 are held between a receiving anvil 13 and a welding horn 11, both being arranged so as to be opposed to each other. The welded horn 11 is oscillated with the aid of an ultrasonic oscillator, and a thermoplastic resin film interposed between the boundary surfaces of the board sawtooth 2 and the carton base material, 4 is melted by local heating generation, whereby both the board sawtooth 2 and base material 4 are bonded to each other.</p>
申请公布号 JPH08230889(A) 申请公布日期 1996.09.10
申请号 JP19950059992 申请日期 1995.02.24
申请人 HONSHU PAPER CO LTD 发明人 OISHI TAKEO;SUGIYAMA KAZUYUKI;SANO MITSUHIRO;MIKAMO HIROAKI
分类号 B65D5/72;B29C65/08;B29C69/00;B65D25/52;B65D83/08;(IPC1-7):B65D25/52 主分类号 B65D5/72
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