发明名称 |
IC package and packaging method for the same |
摘要 |
Plural kinds of metal wiring patterns on which a lid is to be put are formed on a package body. The wiring patterns connected to an IC chip are changed depending upon the size of the lid which is put on the package body. Either of an IC chip operated by a single power supply and an IC chip operated by positive and negative power supplies can be packaged without changing the wiring patterns in the package.
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申请公布号 |
US5554824(A) |
申请公布日期 |
1996.09.10 |
申请号 |
US19920997756 |
申请日期 |
1992.12.30 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
UEDA, MASAHIRO;MATSUE, SHUICHI |
分类号 |
H01L23/02;H01L21/48;H01L23/057;H01L23/13;H01L23/498;H01L23/50;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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