| 摘要 |
PURPOSE: To integrally laminate a metal foil and a polyimide substrate layer with high adhesion by laying the metal foil over a multilayer extruded polyimide thin film provided by integrally laminating thermoplastic aromatic polyimide layers of a low logarithmic viscosity on a side of a high temperature-resistant polyimide substrate layer, and then heating and pressurizing the layers. CONSTITUTION: A multilayer extruded polyimide film 2 of a metal foil-laminated polyimide film 1 is formed by integral lamination of a thermoplastic aromatic polyimide thin film on at least one side of a high temperature-resistant aromatic polyimide substrate layer, which is achieved by, for example, the multilayer extrusion of a substrate layer polyimide precursor solution together with a thin film polyimide solution or its precursor solution. The metal foil-laminated polyimide film 1 is formed by laying a metal foil 3 on the thermoplastic aromatic polyimide thin film of the multilayer extruded polyimide film 2 and then heating and pressuring them for lamination. |
