发明名称 Solderless terminal
摘要 A solderless terminal for interconnecting a terminal to a lead wire in which the terminal has superior mechanical strength to enable the plate material used in manufacturing the terminal to have a minimum thickness thus reducing the overall size and weight of the terminal. The solderless terminal includes an electrical contact portion engageable with a mating connecting terminal and a conductor connecting portion having at least two core-wire contact slots longitudinally spaced from each other. Each of the core-wire contact slots is defined by a pair of opposing conductor clamping blades adapted to cut an insulating cover of a lead wire and retain the conductor of the lead wire to thereby electrically connect the terminal to the conductor. The terminal also includes first and second constricted portions each having a cubic shape defined by a bottom plate and opposing side walls which are bent inwardly to form right and left reinforcing walls. The conductor connecting portion has right and left side walls to accommodate a part of the lead wire. The end portions of the right and left side walls are bent inwardly substantially in the same direction as the reinforcing walls of the constricted portions to form the conductor clamping blades.
申请公布号 US5554046(A) 申请公布日期 1996.09.10
申请号 US19940362898 申请日期 1994.12.23
申请人 YAZAKI CORPORATION 发明人 SUGIYAMA, OSAMU;YAGI, SAKAI
分类号 H01R4/24;(IPC1-7):H01R4/24 主分类号 H01R4/24
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