| 摘要 |
PURPOSE: To achieve excellently low dielectric constant and excellently low dielectric loss tangent by dissolving in an organic solvent an epoxy resin composition of an epoxy resin, an aryl ester compound represented by the formula, and a hardening accelerator, and impregnating a substrate with the solution, and then thermally forming the obtained prepreg and a copper foil. CONSTITUTION: A prepreg is obtained by impregnating a substrate with an epoxy resin solution obtained by dissolving in an organic solvent an epoxy resin composition of an epoxy resin, a hardening accelerator, and an aryl ester compound represented by the formula, [where n is an average of repetitions ranging from 0.1 to 20; Ar, Ar' are each independently represent a benzene nucleus and a naphthalene nucleus; P, P' are each independently represent an alkyl, cycloalkyl or aryl group with 1-10, 5-10 or 6-20 carbon atoms; R represents a hydrogen atom or an alkyl or aryl group with 1-10 or 6-20 carbon atoms; and Z, Z' are each independently represent a hydrogen atom or an acyl group with at most 20 carbon atoms; (where hydrogen atoms do not occupy all the positions, i, k are integers within 1-3, 1-4, k+1 being 4 or less; and j, m are integers within 0-4, 1-5, j+m being 5 or less). The prepreg and a copper foil are formed together by heating. |
