发明名称 |
ETHYLENIC RESIN COMPOSITION |
摘要 |
PURPOSE: To provide an ethylenic resin composition for extrusion molding generating slight rough surface and fuming or scums in molding, suitably used for extrusion molding and obtainable of a molded material having high rigidity and high strength. CONSTITUTION: The objective ethylenic resin composition is composed of 30-60wt.% below-cited component (A) and 70-40wt.% component (B). (A) An ethylenic polymer having 50-1000g/10min MFR(melt flow rate) at 190 deg.C and <=2.2 of a ratio of complex viscosityη1 * at G1 *=1.94×10<4> Pa to complex viscosityη2 * at G2 *=1.94×10<5> Pa:η1 */η2 * in a curve of complex viscosity (η*) vs. complex modulus (G*) measured at 190 deg.C. (B) An ethylenic polymer having 1.0-5.0g/10min HLMFR(high load melt flow rate) at 190 deg.C and >=3.0 of a ratio of complex viscosityη1 * at G1 *=1.94×10<4> Pa to complex viscosityη2 * at G2 *=1.94×10<5> Pa:η1 */η2 *.
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申请公布号 |
JPH08231781(A) |
申请公布日期 |
1996.09.10 |
申请号 |
JP19950032667 |
申请日期 |
1995.02.21 |
申请人 |
SHOWA DENKO KK |
发明人 |
MATSUOKA KIYOBUMI;HIRABAYASHI KAZUYUKI;MIYAKE SHIGENOBU;YAMAMOTO MASAKAZU;KIYABU KAORU |
分类号 |
C08L23/04;C08L23/00;(IPC1-7):C08L23/04 |
主分类号 |
C08L23/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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