发明名称 ETHYLENIC RESIN COMPOSITION
摘要 PURPOSE: To provide an ethylenic resin composition for extrusion molding generating slight rough surface and fuming or scums in molding, suitably used for extrusion molding and obtainable of a molded material having high rigidity and high strength. CONSTITUTION: The objective ethylenic resin composition is composed of 30-60wt.% below-cited component (A) and 70-40wt.% component (B). (A) An ethylenic polymer having 50-1000g/10min MFR(melt flow rate) at 190 deg.C and <=2.2 of a ratio of complex viscosityη1 * at G1 *=1.94×10<4> Pa to complex viscosityη2 * at G2 *=1.94×10<5> Pa:η1 */η2 * in a curve of complex viscosity (η*) vs. complex modulus (G*) measured at 190 deg.C. (B) An ethylenic polymer having 1.0-5.0g/10min HLMFR(high load melt flow rate) at 190 deg.C and >=3.0 of a ratio of complex viscosityη1 * at G1 *=1.94×10<4> Pa to complex viscosityη2 * at G2 *=1.94×10<5> Pa:η1 */η2 *.
申请公布号 JPH08231781(A) 申请公布日期 1996.09.10
申请号 JP19950032667 申请日期 1995.02.21
申请人 SHOWA DENKO KK 发明人 MATSUOKA KIYOBUMI;HIRABAYASHI KAZUYUKI;MIYAKE SHIGENOBU;YAMAMOTO MASAKAZU;KIYABU KAORU
分类号 C08L23/04;C08L23/00;(IPC1-7):C08L23/04 主分类号 C08L23/04
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