| 摘要 |
The method includes loading a printed circuit board (PCB) to a printing machine; aligning a stencil to the PCB when the PCB has been loaded to the printing machine; setting a snap-off distance; dispensing a volume of solder paste onto the stencil, the volume of solder paste being dispensed onto the stencil regardless of whether the PCB has been loaded to the printing machine; placing a squeegee in contact with the stencil at a predetermined pressure; moving the squeegee across the stencil at a predetermined speed; waiting a constant period of time; and repeating.
|
