Bond-Maschine für Halbleiter-Chips

摘要

The invention provides a chip device bonding machine in which bubbles can be effectively prevented from remaining in an adhesive (7) or the like. A flexible board (1) is moved on a base (14) at every unit by the rotation of reels (15S, 15T). In accordance with the movement of the flexible board (1), a new portion of a tape (16) made of a film, a paper or the like is moved above the base (14). The tape (16) is located between the flexible board (1) and the base (14). A thermosetting adhesive (7) is deposited on the flexible board (1) on the base (14) by an adhesive nozzle (20). An IC chip (3) is placed on the flexible board (1) on the base (14) by an IC chip supply arm (18). A pressing arm (22) including a heater (23) presses and heats the IC chip (3) toward the base side to interconnect the IC chip (3) to the flexible board (1). When the IC chip (3) is heated and pressed by the pressing arm (22), the tape (16) is concaved at its portions corresponding to bumps and consequently the flexible board (1) is deformed, whereby bubbles produced within the adhesive (7) are pushed out to the outside. Thus, the bubbles can be effectively removed from the adhesive (7). <IMAGE>