发明名称 MOLD FOR TRANSFER MOLDING
摘要 PURPOSE:To prevent the generation of resin flashes, adhered to the side surface of a sheet member, and contrive the reduction of molding cost by a method wherein a resin reservoir, forming a side surface as one part of an inner surface, is provided along the side surface of the sheet member. CONSTITUTION:The gap (w) of the degree of 0.1mm, which is provided between the inside surface of an insert zone 5 for a mold and the side surface of a lead frame A, is formed as a resin reservoir 8 provided with a large sectional area. The resin reservoir 8 is connected to a gate 7 in the this mold, therefore, resin flows into the resin reservoir 8 when molding resin is cast into cavities 3, 4. Accordingly, the resin which flows into the resin reservoir 8 forms a resin reservoir section E, attached to the side surface of the lead frame A of a molded form taken out of the mold. When a flow passageway section D is removed from the molded form, the resin reservoir section E is removed together with the flow passageway D since a connecting strength between the resin reservoir section E and the flow passageway section D as well as the strength of the resin reservoir section E itself are stronger than an adhering strength between the resin reservoir section E and the flow passageway section D, therefore, the molding resin will never remain on the side surface of the lead frame A.
申请公布号 JPS62261414(A) 申请公布日期 1987.11.13
申请号 JP19860106111 申请日期 1986.05.09
申请人 FUJITSU LTD 发明人 KUBOTA AKIHIRO;SATO SHIGERU;SUZUKI HIDEO;SUZUKI TOSHIAKI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/37;B29K105/20;B29L31/34 主分类号 H01L21/56
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