| 摘要 |
PURPOSE:To reduce the yield of cracks on the surface of a compound semiconductor element, by bonding a sub-mount for a semi-insulating substrate, to which a semiconductor element is bonded, to a package. CONSTITUTION:A package 1 and lead wires 2 are fixed with insulation being kept with glass 3. A sub-mount, to which an InP element 20 is bonded with a solder material 21, is bonded to the surface of the package 1 with a solder material 13, whose melting point is lower than the solder material 21. Then, an electrode 12 and the InP element 20 are electrically connected to the lead wires 2 with bonding wires 4. A cap 5 is welded to the package 1. Thus, thermal strain to a compound semiconductor element becomes less, and the reliability of the element is improved. |
