| 发明名称 |
Wafer bonding of light emitting diode layers |
| 摘要 |
<p>A method of stacking light emitting diodes (LEDs) comprises the steps of epitaxially growing first LED layers (34,36,38) to form a first LED structure (40); epitaxially growing second LED layers (66,68,70) to form a second LED structure (64); stacking the first LED structure onto the second LED structure; and wafer bonding the first LED structure to the second LED structure.</p> |
| 申请公布号 |
EP0730311(A2) |
申请公布日期 |
1996.09.04 |
| 申请号 |
EP19960106637 |
申请日期 |
1994.01.21 |
| 申请人 |
HEWLETT-PACKARD COMPANY |
发明人 |
KISH, FRED A.;STERANKA, FRANK M.;DEFEVER, DENNIS C.;ROBBINS, VIRGINIA M.;UEBBING, JOHN |
| 分类号 |
H01L21/02;H01L21/20;H01L21/60;H01L25/075;H01L33/00;H01L33/14;H01L33/30;(IPC1-7):H01L33/00 |
主分类号 |
H01L21/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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