| 摘要 |
A surface mount device desoldering and removal tool includes a flexible carrier plate and a plurality of heated legs attached to the flexible carrier plate for contacting the leads of an electrical component. The flexible carrier plate is sufficiently flexible so that the flexing of the carrier plate allows the plurality of legs to deflect outward to accommodate electrical components of varying sizes. The plurality of legs are heated by electrical resistance heating elements to melt the solder which connects an electrical component to a circuit board. The legs provide a grip on the leads of the electrical component which allows the removal tool to lift the electrical component from the circuit board when all the solder connections have been melted. The flexible carrier plate is advantageously provided with shoulders which allow the electrical component to be easily removed from the removal tool. |
