发明名称 |
MULTI-CHIP ELECTRONIC PACKAGE MODULE UTILIZING AN ADHESIVE SHEET |
摘要 |
There is provided a module for supporting a plurality of semiconductor devices within an electronic package. The module has a support substrate and an apertured substrate laminated together with a polymer adhesive. A plurality of semiconductor devices are disposed within apertures formed in the apertured substrate and bonded to the support substrate by that same polymer adhesive. |
申请公布号 |
EP0729644(A1) |
申请公布日期 |
1996.09.04 |
申请号 |
EP19950901690 |
申请日期 |
1994.10.19 |
申请人 |
OLIN CORPORATION |
发明人 |
HOFFMAN, PAUL, R.;LIANG, DEXIN |
分类号 |
H01L25/18;H01L21/58;H01L23/057;H01L23/13;H01L23/31;H01L23/495;H01L25/04 |
主分类号 |
H01L25/18 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|