| 摘要 |
A semiconductor device 1 having external lead terminals 14 and 15 on an upper level surface portion 12 and a lower level surface portion 13 formed in a top cover 11 of a resin package so as to produce a level difference between them in combination with an external lead terminal adaptor 2 having terminal conductors 22 on a terminal block body 21 adapted to be stacked on the lower level surface portion so that the level difference between the higher and lower level portions is compensated, and the terminal conductors of the adaptor are connected with the external lead terminals disposed on the lower level portion of the semiconductor device. This enables the terminal conductors and external lead terminals to have the same level or to be aligned in the same plane, so that external wiring between the semiconductor device and the printed circuit board mounted thereon can be easily accomplished. <IMAGE> |
