发明名称 Laser machining method and apparatus therefor
摘要 <p>In a laser processing method and a laser processing apparatus for projecting a laser beam to a work so as to process this work, an irradiated shape of the laser beam is defined in such a manner that a desirable processing region of the work is irradiated by the laser beam, and also a power density distribution of the laser beam is defined in such a manner that power density suitable for processing each portion of the work is given to each portion of the work within the desirable processing region. <IMAGE></p>
申请公布号 EP0504850(B1) 申请公布日期 1996.09.04
申请号 EP19920104702 申请日期 1992.03.18
申请人 HITACHI, LTD. 发明人 HONGO, MIKIO;MIYAUCHI, TATEOKI;MARUYAMA, SHIGENOBU;SAKAMOTO, HARUHISA;MIZUKOSHI, KATSURO
分类号 B23K1/00;B23K26/03;B23K26/06;B23K26/073;G02F1/1343;H05K3/02;(IPC1-7):H05K3/00 主分类号 B23K1/00
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