发明名称 |
Laser machining method and apparatus therefor |
摘要 |
<p>In a laser processing method and a laser processing apparatus for projecting a laser beam to a work so as to process this work, an irradiated shape of the laser beam is defined in such a manner that a desirable processing region of the work is irradiated by the laser beam, and also a power density distribution of the laser beam is defined in such a manner that power density suitable for processing each portion of the work is given to each portion of the work within the desirable processing region. <IMAGE></p> |
申请公布号 |
EP0504850(B1) |
申请公布日期 |
1996.09.04 |
申请号 |
EP19920104702 |
申请日期 |
1992.03.18 |
申请人 |
HITACHI, LTD. |
发明人 |
HONGO, MIKIO;MIYAUCHI, TATEOKI;MARUYAMA, SHIGENOBU;SAKAMOTO, HARUHISA;MIZUKOSHI, KATSURO |
分类号 |
B23K1/00;B23K26/03;B23K26/06;B23K26/073;G02F1/1343;H05K3/02;(IPC1-7):H05K3/00 |
主分类号 |
B23K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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