发明名称 SAWING DEVICE USING WIRE INCORPORATED IN INTEGRAL FRAME
摘要 PROBLEM TO BE SOLVED: To provide a sawing device which is capable of passively controlling the dimensional accuracy of a part to be sawn while removing elasticity and heat effects and consequently, absorbing an increase in the temperature change without adversely affecting the quality of a produced part by structuring a sawing region monolithically. SOLUTION: The sawing device includes a web 2 consisting of parallel wires which continuously move or reciprocate while pressing a part 1 to be sawn fixed to a support table 3 and is built into a monolithic frame 6. The frame 6 is of an integrated and simple casinglike structure which enables the dimensional accuracy of the part 1 to be sawn to be passively controlled. The structure has four opening parts 7 which form an inlet. The opening parts 7 are symmetrically positioned around a sawing region and at the same time, demarcate four support pillars 8, which are arranged, spaced from each other, around the sawing region and have axes extending in parallel in the sawing direction. The support table 3 is positioned above in the perpendicular direction and moves in the direction parallel with the support pillar 8.
申请公布号 JPH08224725(A) 申请公布日期 1996.09.03
申请号 JP19950301556 申请日期 1995.11.20
申请人 SHIYARURU OSERU 发明人 SHIYARURU OSERU
分类号 B24B27/06;B23D57/00;B23Q11/12;B28D1/08;B28D5/04;(IPC1-7):B28D1/08 主分类号 B24B27/06
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