| 摘要 |
PROBLEM TO BE SOLVED: To minimize effects between chips in a slight dimension, while all of necessary functions for optical data transmission are included such as transmission, reception and amplification. SOLUTION: A semiconductor assembly for bidirectional optical data transmission without conduction comprises a transmitting chip 4 emitting beam in the range of infrared, a receiving chip 1 generating a photocurrent in reaction to the beam within infrared ray range, and an integrated circuit 2 amplifying the photocurrent of a receiving chip 1. These three semiconductor chips 4, 1 and 2 are provided on a conductive strip device 3, having at least three strips 3, 1-3 and 9. The integrated circuit 2 is provided on a first surface parallel to the longitudinal direction of the conductive strip device 3, and the transmitting chip 4 and the receiving chip 1 are provided on a second surface which is orthogonal with respect to the first surface at the end of the conductive strip device 3. |
