| 摘要 |
PURPOSE: To prevent the concentration of thermal stress to one side of a soldering section or the non-soldering side by interposing a spacer, in which a cross section is formed in a wedge shape and scaled up gradually and which surrounds a lead pin, between the lead pin and a through-hole while directing the thin wall side inwards on the non-soldering side. CONSTITUTION: A spacer 3, in which a cross section is formed in a wedge shape and scaled up gradually and which is made of a metal, is fitted on the non-soldering side 5 of a lead pin 1, and the spacer 3 is interposed between the lead pin 1 and a through-hole 2. Since the spacer 3 is formed in a cylindrical shape, the lead pin 1 is supported by a wide area specified by the whole circumference and cylindrical length. The lead pin 1 is supported through the spacer 3 not only in a soldering member but also on the non-soldering side 5. Accordingly, the concentration of thermal stress, etc., on one side of the soldering member or the non-soldering side 5 can be prevented. |
