发明名称 MOLDED CIRCUIT COMPONENT UNIT FOR CONNECTING LEAD WIRES AND A METHOD OF MANUFACTURING SAME
摘要 A molded circuit component for connecting to lead wires includes body and a protective cover. The body includes a partition wall area having a plurality of housing grooves, partition walls, body notches, positioning projections and fastening pin reception apertures. The protective cover includes a plurality of cover notches, recesses and fastening pins to correspond respectively with the body notches, positioning projections and fastening pin reception apertures. Metal lines having connection terminals on their ends are embedded in the housing grooves. Lead wires are positioned in the grooves so that the conductors of the lead wires are placed on, and attached to, the connection terminals. The protective cover is then attached to the body.
申请公布号 CA2022526(C) 申请公布日期 1996.09.03
申请号 CA19902022526 申请日期 1990.08.02
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;SANKYO KASEI, CO., LTD. 发明人 URUSHIBATA, KENICHI;SUGAWARA, KIYOTO;MATSUDA, TATSUO;SAEN, HARUO;KOJIMA, KEIICHI;KAWASAKI, SYUSAKU;HATASE, HIROSHI;SAITO, KATSUYA;YUMOTO, TETSUO;YOSHIZAWA, NORIO;KANNO, TOORU
分类号 H01R4/02;H01R12/08;H01R12/10;H01R13/504;H01R13/514;H01R43/02;H02G15/08;(IPC1-7):H01R13/504 主分类号 H01R4/02
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