| 摘要 |
<p>PURPOSE: To provide a lead recovery method from waste product and a device therefore, capable of efficiently recovering lead in soldering alloy adversely affecting environment, etc., from waste product such as waste electronic parts. CONSTITUTION: This is a device 1 to recover lead in soldering alloy from the waste product for which lead-tin soldering alloy is used and in which copper as constituting material is contained. The lead recovery device 1 is provided with a crashing part 10 to crash waste product, a heating part 20 to heat crashed matter of waste product and to generate lead gas by using a difference among respective vapor pressures of lead, tin and copper, and a recovery part 30 to recover lead by cooling lead vapor generated at the heating part 20. By heating the waste product to a temp. in the range of 1273-2073K, lead is separated/recovered due to the difference among respective vapor pressures of lead, tin and copper.</p> |
