发明名称 MANUFACTURE OF MOLDED CIRCUIT PART, AND CIRCUIT MOLDED PART MANUFACTURED BY THIS METHOD
摘要 <p>PURPOSE: To prevent the twisting of a primary molding, and ensure the plane precision of a circuit molding. CONSTITUTION: A primary molding 1 has slits 14 of five lines in total formed between parts 2 corresponding to adjacent mounting connectors and the outside thereof, these slits have a width extending to irregular through-holes 21 formed on both side end surfaces of the part 2 corresponding to the mounting connector, and the longitudinal direction of the slits is laid along the longitudinal direction of the part 2 corresponding to the mounting connector. Therefore, even when an internal stress is generated in the center part of the primary molding 1 in the molding process within a cavity, it is absorbed by the slits 14. Thus, the slits are formed on the primary molding within the cavity.</p>
申请公布号 JPH08227787(A) 申请公布日期 1996.09.03
申请号 JP19950056757 申请日期 1995.02.22
申请人 SANKYO KASEI CO LTD 发明人 YUMOTO TETSUO
分类号 B29C45/26;H01R24/00;H01R43/00;H01R43/24;H05K3/00;(IPC1-7):H01R43/24;H01R23/02 主分类号 B29C45/26
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