发明名称 |
MANUFACTURE OF COPPER-CLAD LAMINATED PLATE |
摘要 |
PURPOSE: To provide a copper-clad laminated plate made of, as a base material, an aramid fiber unwoven fabric having a small coefficient of thermal expansion and a high heat resistance at the time of moisture absorption. CONSTITUTION: An aramid fiber unwoven fabric is impregnated with a resin and dried so as to obtain a prepreg. A copper foil is superposed on the prepreg so as to form a body to be pressed. The body to be pressed is heated and pressed until a cured plate thickness of the prepreg becomes 60-80% of the thickness of the prepreg. |
申请公布号 |
JPH08224832(A) |
申请公布日期 |
1996.09.03 |
申请号 |
JP19950034175 |
申请日期 |
1995.02.23 |
申请人 |
MATSUSHITA ELECTRIC WORKS LTD |
发明人 |
ITO KOICHI;MISAWA HIDETO |
分类号 |
C08J5/24;B29C70/06;B29K105/08;B29L9/00;B32B15/08;H05K1/03;(IPC1-7):B32B15/08 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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