| 摘要 |
A dipping head dips planar arrays of electronic components, disposed in carriers, into sheets of termination paste that are conveyed to a dipping site by a conveyor having an upper planar surface. The sheets are produced atop the conveyor by a doctoring device. The conveyor can be a belt, preferably an endless belt of stainless steel. A wear plate provides vertical support for the belt at the dipping site in order to maintain the planarity of the sheet of termination paste. Preferably the wear plate is perforated with a vacuum source below to hold the belt snug against the plate. The doctoring device is located before (referenced to the direction of belt travel) the dipping site and can be a reservoir of paste riding atop the belt with the paste selectively metered out by raising or lowering of the blade against the belt. A scraper blade can be located after the dipping site to recover leftover paste and guide it into a device which pumps the paste through a filter and back to the reservoir. A tape of cleaning material rubs against a run of the belt, after the scraper blade but before the doctoring device, to further cleanse the belt.
|
