发明名称 ELECTRICAL PART PACKAGE
摘要 PROBLEM TO BE SOLVED: To reduce thermal resistance between a power consumption part and a base plate by placing an electrical component on a base plate with a power consumption face so that it can be brought into contact with it, and electrically connecting a pad with a conductive material. SOLUTION: A power consumption component 13 is directly placed on a thermal conductive base plate 15 made of aluminum. A multilayer printed circuit board 17 is arranged on a power consumption part 13, and electrical connection is directly operated between the power consumption part 13 and the printed circuit board 17. The power consumption component 13 includes a substrate 213. The power consumption component 13 directly placed on the power consumption component 13 and the printed circuit board 17 so that thermal resistance between the power consumption component 13 and the printed circuit board 17 can be reduced.
申请公布号 JPH08228071(A) 申请公布日期 1996.09.03
申请号 JP19950293000 申请日期 1995.11.10
申请人 V L T CORP 发明人 SUTEFUAN AARU PURUEN;UORUTAA AARU HETSUDORANDO SAADO
分类号 H05K1/02;H05K1/14;H05K1/18;H05K3/00;H05K3/34;H05K3/36;H05K3/40;H05K3/42;H05K5/00;H05K7/20 主分类号 H05K1/02
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