MANUFACTURING SYSTEM AND MANUFACTURING METHOD

摘要

PURPOSE: To select the processing, as required, by proving a first transfer arm for transferring an object while aligning individually, a second transfer means for receiving the object and transferring the object in X direction, and a plurality of processing chambers disposed along the transfer path. CONSTITUTION: A channel 102 is provided in the center of a base 101 and a unit 110 for transferring a wafer in Y direction is disposed in the channel 102. A wafer transfer mechanism 120 is disposed on the left side of the base 101 and provided with a wafer cassettes 122, 123 for containing unprocessed and processed semiconductor wafers WB, WF, respectively. A pincette 121 of the transfer mechanism 120 hand avers an unprocessed wafer WB to the pincettes 112, 113 of the transfer unit 110 and receives a processed wafer WF from the pincettes 132, 113. The semiconductor wafer W is passed through the processing stations 103-108 according to a predetermined order. Operation of the transfer unit 110 is entirely controlled by a control system.