| 摘要 |
<p>PURPOSE: To provide a technique for greatly increasing bonding strength between resin of a package of a semiconductor device and a lead even if the semiconduc tor device is for mounting a resin sealed semiconductor device, especially, a large pellet. CONSTITUTION: This method comprises a process for forming a lead frame with a plurality of leads 2a, a process for bonding an insulation sheet 5 to the lead 2a, a process for bonding the insulation sheet 5 to a circuit formation surface of a square semiconductor pellet 1 having a circuit formation surface wherein a semiconductor integrated circuit is formed and a non-circuit formation surface opposite thereto, a process for electrically connecting a bonding pad 7 arranged in a circuit formation surface and the lead 2a through a wire 8 and a process for sealing the semiconductor pellet 1 and the lead 2a with resin.</p> |
