| 发明名称 |
Ceramic filled composite polymeric electrical substrate material exhibiting high dielectric constant and low thermal coefficient of dielectric constant |
| 摘要 |
A high dielectric (K'>/=5), comparatively low thermal coefficient (absolute value of TCK'</=200 ppm/ DEG C.) polymeric composite matrix is presented comprising commonly available and low cost fillers such as titania, alumina and magnesium oxide.
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| 申请公布号 |
US5552210(A) |
申请公布日期 |
1996.09.03 |
| 申请号 |
US19940335510 |
申请日期 |
1994.11.07 |
| 申请人 |
ROGERS CORPORATION |
发明人 |
HORN, III, ALLEN F.;BUSH, ROBERT L.;ST. LAWRENCE, MICHAEL E. |
| 分类号 |
C08K3/22;C08L27/12;C08L71/00;C08L71/12;C08L101/00;H01B3/02;H05K1/03;H05K1/16;(IPC1-7):B32B3/00 |
主分类号 |
C08K3/22 |
| 代理机构 |
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