| 摘要 |
A palladium alloy plating composition comprising 4 to 20 g/l of palladium ion, 0.3 to 2.0 g/l of gold ion, 5 to 100 g/l of a conductive salt and 0.5 to 20 g/l of a complexing agent, and optionally 0.3 to 5 g/l of an alloying metal ion provides a plating with an excellent solderability and flexibility onto a substrate by an electrical plating method.
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