MANUFACTURE OF ELECTRONIC DEVICE

摘要

PURPOSE: To improve yield of an electronic device in a manufacturing process and miniaturize an electronic device. CONSTITUTION: A manufacturing method of an electronic device wherein each one end side of a plurality of outer leads 3A is fixed to each of a plurality of connection terminals 2 arranged in at least one side of a wiring board 1 along the one side by solder 6 based on a solder dip method has a process for forming a lead frame wherein a plurality of outer leads 3A are arranged and forming an insulation layer 5 on each of opposite side surfaces of adjacent outer leads 3A. It is also provided with a process for fixing each one end side of a plurality of outer leads 3A to each of a plurality of connection terminals 2 by solder 6 based on a solder dip method.