SEMICONDUCTOR DEVICE

摘要

PURPOSE: To greatly increase bonding strength between resin of a package of a semiconductor device and a lead even if the semiconductor device is for mounting a large pellet by bonding a first lead to a circuit formation surface of a semiconductor pellet and arranging a second lead outside the semiconductor pellet. CONSTITUTION: An insulation sheet 5 sized not to cover a bonding pad is bonded to a circuit formation surface of a pellet 1. An inner lead of a lead 2a with an outer lead in a side of a bonding pad non-formation side of a pellet is extended to an upper surface of the insulation sheet 5. A lead has the lead 2a to be bonded to a circuit formation surface of the pellet 1 and a lead 2d to be arranged outside the pellet 1. An inner lead part of the lead 2a is connected to a bonding pad 7 through a wire 8a and an inner lead part of the lead 2d is connected to the bonding pad 7 through a wire 8b.