| 摘要 |
PURPOSE:To improve the mounting density of a printed board by mounting semiconductor integrated circuit chips on the upper surface and the lower surface of the chip mounting part of a lead frame, connecting electrically the chips and leads of the lead frame, and sealing them in a package with resin or the like. CONSTITUTION:On the upper surface of the chip mounting part 1a of a lead frame 1, one semiconductor integrated circuit chip 2 is mounted, and connected electrically to the upper surface of a lead 1b of the lead frame 1 with a bonding wire 4. On the rear of the chip mounting part 1a, the other semiconductor integrated circuit chip 3 is mounted, and connected electrically to the lower surface of a lead 1c different from the lead 1b, by using a bonding wire 5. The chips 2, 3, the chip mounting part 1a and the leads 1b, 1c of the lead frame 1, and the bonding wires 4, 5 are sealed with resin 6 or the like, and a package is formed. The kinds of chips 2, 3 may or may not be identical.
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