| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
| 摘要 |
PURPOSE: To reduce a manufacturing cost of a film carrier semiconductor device. CONSTITUTION: A semiconductor device which is constituted by performing outer lead bonding for an outer lead bonding lead 4 of a film carrier semiconductor device to an inner lead 5 of a lead frame is constituted by using a lead frame whereto plating such as silver is not applied is used for a surface of the inner lead 5 on a lead frame and using an electric resistance welding method for outer lead bonding.
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| 申请公布号 |
JPH08227962(A) |
申请公布日期 |
1996.09.03 |
| 申请号 |
JP19950030498 |
申请日期 |
1995.02.20 |
| 申请人 |
NEC CORP |
发明人 |
YAMASHITA TSUTOMU;OGASAWARA KIYOTAKA |
| 分类号 |
H01L21/603;H01L21/60;H01L23/04;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L21/603 |
| 代理机构 |
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