| 摘要 |
<p>PURPOSE: To provide a thick communication IC card structure in accordance with ISO 7813 standards. CONSTITUTION: A communication IC module 4 is formed by arranging and forming an IC mount part, a power receiving coil 2, and a data transmitting and receiving coil 3 in an area off a magnetic stripe area and an embossment area along the length, and the receiving coil and communication coil are single- layered coils; and the respective coils and a lead part which is coupled with the pad of an IC chip from the respective coils is embedded in one striped substrate and the communication IC module having an IC chip mounted on the stripped substrate is sandwiched between a sheet covering its top and bottom surfaces and plural sheets having windows off the module shape and heated and pressed to constitute the communication IC card having the communication module incorporated in one body. Consequently, this card is a thin type satisfying the maximum thickness of 0.84mm of the ISO 7813 standards and used for both a magnetic stripe and an embossment system, and the structure which is superior in mechanical strength, ability of the environment resistance, and mass-productivity is obtained.</p> |
