| 摘要 |
PURPOSE: To reduce difference in cooling, conditions generated depending on a position of an element attached to a cooling block. CONSTITUTION: A condenser 2B is connected to an upper end of a cooling block 1 through a header 3D at a front side. A condenser 2A is provided adjacent to a left side of the condenser 2B. A lower end of a header 3A at a rear end of the condenser 2 and a center of the cooling block 1 are connected by a pipe 7A. A lower end of a header 3B of the condenser 2A and a left upper end of the cooling block 1 are connected by a return pipe 6A. A lower end of a header 3C at a rear end of the condenser 2B and a lower end of the cooling block 1 are connected by a return pipe 6B. Refrigerant which is heated and gasified by a semiconductor element 5 at a lower end of the cooling block 1 is made to flow into a feed pipe 7A and prevents lowering of cooling conditions of the semiconductor element 5 attached to an upper part of the cooling block 1. |
