发明名称 WORKING OF ELECTRONIC COMPONENT USING LASER
摘要 PURPOSE:To effectively remove burrs without giving damage to components and lowering reliability by using water by a method wherein the burrs of an insulating and sealing material are removed by laser irradiation, and at the same time, a masking is conducted. CONSTITUTION:A bridge 7b is brought into an inconspicuous state by having the narrowing direction of a laser beam by a meniscus lens 8 coincided with the narrow-width direction of the bridge 7b of the pattern punched out by a stainless 7, and the burrs on the part of the bridge 7 can be removed completely by dissolving. As said burr-removing process and the marking process using a laser passing hole 7a can be conducted simultaneously, one process can be reduced.
申请公布号 JPH01258403(A) 申请公布日期 1989.10.16
申请号 JP19880085266 申请日期 1988.04.08
申请人 USHIO INC 发明人 YOKOTA TOSHIO
分类号 B29C37/02;B29K105/24;B29L31/34;H01C1/04;H01C17/02;H01L21/56 主分类号 B29C37/02
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