| 摘要 |
PURPOSE: To facilitate the alignment of a mask and a substrate to be formed with films by providing this substrate with plural projections for positioning, superposing the substrate on the mask by inserting these projections into the positioning holes of the mask and forming films on film forming parts by vapor deposition. CONSTITUTION: Many leader electrodes 22 and several pieces of dummy electrodes 23 are formed on the substrate 21 to be formed with the films. The metal mask 24 for forming stud bumps is superposed on a wafer 21. Only the dummy electrodes 23 are exposed. The stud bumps 25 are formed on the dummy electrodes 23 by a ball bonding device. The mask 24 is removed. The second openings 26b of the metal mask 26 are aligned to the stud bumps 25 and is superposed on the wafer 21. The positions of the first openings 26a of the mask 26 and the leader electrodes 21 are automatically aligned. The mask 26 is fixed by a magnet 27. The wafer 21 is put into a vacuum vapor deposition device where solder films 28 are formed on the leader electrodes 22 by vapor deposition. The need for a dummy substrate, etc., for the purpose of transfer is eliminated. |
